Industry Insight: Challenges in the Era of Advanced Packaging
Three Major Technical Bottlenecks Facing Current Sorting Equipment
Industry Background & Core Challenges
Integrated circuits are evolving toward miniaturization, ultra-thin profiles, and high integration. Emerging applications such as SiP, high-speed optical modules, and Chiplet impose entirely new demands on the sorting process.
- Challenge 1: Insufficient intelligence — unable to accommodate flexible production models characterized by low volume, high variety, and rapid iteration.
- Challenge 2: Lack of data traceability — full-process tracing at the individual die level is unattainable, making quality control difficult.
- Challenge 3: Inadequate force control and precision — incapable of meeting the extreme process requirements of ultra-thin, irregular, and fragile dies.
[Illustration] Advanced packaging technology trends and three major challenges for sorting equipment
Solution: Evolving from Sorting to an Intelligent Data Hub
RX3000 Series — An Intelligent Data Hub That Reshapes Production Line Value
From Sorting to Intelligent Data Hub
Conventional wisdom: The sorting machine is a standalone execution unit that only handles physical transfer.
ACCURACY redefines it: The RX3000 series is an intelligent data hub bridging front-end and back-end processes, simultaneously performing physical operations alongside data acquisition, analysis, and circulation.
- Three Core Attributes: Flexible adaptability, intelligent control, and rock-solid reliability.
[Illustration] RX3000 Series Intelligent Data Hub Architecture
Application Scenarios & Customer Segments
Broad Applicability
Broad Applicability
Serving the entire semiconductor industry chain, with cumulative shipments exceeding one hundred units
- Optical Communication: Silicon photonics chips, VCSEL/PD optical chips, and more.
- Power Semiconductors: SiC, GaN, and other third-generation semiconductors.
- RF & Microwave: GaAs RF chips, air-bridge structure devices, and more.
- MEMS Sensors: Sensors for consumer electronics, medical, and automotive applications.
- R&D Institutions: Supporting process validation and low-volume pilot production.
[Illustration] RX3000 Series Applications Across Semiconductor Sectors
Core Capabilities: Seven Key Advantages Building the Intelligent Data Hub
Advantage 1: Multi-Function Flexible Platform
One machine, multiple capabilities — flexible and adaptable
Natively supports four mainstream sorting modes to accommodate diverse production scenarios
- Supports Film-to-Film, Film-to-Tray, Tray-to-Film, and Tray-to-Tray modes.
- Accommodates low-volume flexible operations and high-volume mass production alike.
- Supports placement at specific positions and custom graphic patterns.
[Illustration] RX3000 Series — Four Sorting Modes
Advantage 2: Exceptional Material Compatibility
Pushing boundaries, achieving full-spectrum compatibility
Tackles the challenge of handling dies ranging from 0.3 mm microchips to 20 mm large-format chips
- Size range: Covers micro-dies as small as 0.3 mm to large dies exceeding 20 mm.
- Thickness capability: Reliably handles ultra-thin dies down to 50–70 μm.
- Angular precision: RX3000pro model achieves angular accuracy up to ±1°.
- Processing capability: Compatible with large, thin, and fragile dies; high-aspect-ratio dies; and irregular, sensitive specialty material dies.
[Illustration] RX3000 Series Material Compatibility
Advantage 3: Extensive Specialized Process Library
Experience-driven, process-backed
3,000+ specialized die process recipes, conquering the challenge of fragile die pickup
- Accumulated 3,000+ specialized die pickup processes.
- High-precision closed-loop constant-force control eliminates crushing, collapse, and edge chipping.
- Specialty die pickup yield > 99.8%.
[Illustration] RX3000 Series Specialized Process Library
Advantage 4: High Cleanliness & ESD Protection Configuration
Cleanliness as your safeguard, safety guaranteed
Meets the stringent environmental requirements of optoelectronic devices and sensitive components
- Cleanliness: Standard model achieves dynamic Class 10,000 / static Class 1,000; higher grades customizable.
- ESD Protection: Optional wafer system static elimination capability.
- Specialized processes: Supports 90°/180° die flipping.
[Illustration] RX3000 Series Cleanroom Environment & ESD Configuration
Advantage 5: Fully Automated Configuration
Intelligently driven, efficiency multiplied
Fully automated changeover and calibration, dramatically boosting production line efficiency
- Fully automated changeover: Supports up to 7 pickup heads and 4 ejector needles with automatic switching.
- Changeover efficiency: Line change time < 1 hour, 80% efficiency gain.
- Automation: Optional automatic loading/unloading system for unattended operation.
[Illustration] RX3000 Series Fully Automated Changeover System
Advantage 6: Intelligent Wafer Map Parsing
The eye of intelligence, precision sorting
Efficiently processes MPW (Multi-Project Wafer) reticles, supporting downstream process data coordination
- Auto Parsing: Supports various wafer mapping file formats.
- Precision Binning: Supports mixed sorting of dies with different bin values on the same reticle.
- Barcode Anti-Error: Supports automatic wafer barcode scanning.
- Data Coordination: The workstation can generate and output post-sort wafer maps.
[Illustration] RX3000 Series Intelligent Wafer Map Parsing
Advantage 7: Three Auxiliary Functions
Quality defense line, end-to-end traceability
AOI inspection, OCR recognition, and data networking — fortifying the quality foundation
- AOI Inspection: Automatically detects physical defects; supports blue film recognition for compensatory secondary sorting.
- OCR Recognition: Reads QR codes / barcodes to bind product information.
- Data Traceability: Interfaces with MES systems to achieve full-lifecycle tracking at the individual die level.
[Illustration] RX3000 Series Quality Traceability System
Customer Value: Empowering Efficient Production, Building a Quality Moat
Creating Value, Winning the Future Together
Five Core Values the RX3000 Series Delivers
- Ensuring quality and safety for high-value dies: End-to-end traceability eliminates risk.
- Preserving the integrity of fragile dies: Damage-free processing boosts yield.
- Meeting the precision demands of advanced nodes: Accurate positioning safeguards back-end yield.
- Enhancing overall production line efficiency: Intelligent changeover and stable operation (MTBA > 1 hour).
- One-stop delivery and service assurance: Rapid delivery (within 45 days) with localized after-sales support.
[Illustration] RX3000 Series Customer Value System
About Us: Built on Over a Decade of Deep Expertise
Built on Over a Decade of Deep Expertise
Built on Over a Decade of Deep Expertise
Dedicated to semiconductor advanced packaging equipment, committed to becoming a leading provider of intelligent equipment solutions
- Company Profile: Over a decade of experience in semiconductor die bonding processes and system-level packaging.
- Technical Strength: Independent R&D, modular design, industry-leading core technologies.
- Service Commitment: Rapid delivery, localized after-sales support, dedicated laboratory services.
[Illustration] ACCURACY Company Overview & Capability Showcase