Die Sorting Multi-Function Sorting Expert

RX2000SP3
8" Multi-Function Die Sorter

RX2000 SP3

±38μm ·8" Wafer

±38μm

Placement Accuracy

Max 4K

Throughput (UPH)

Max 8"

Wafer Size

The RX2000SP3 supports film-to-film, tray-to-tray, tray-to-film, and film-to-tray sorting modes. It handles panel wafers, multi-bin wafer map sorting, and adapts to diverse production requirements.

RX2000SP3 Multi-Functional Die Sorter Details

Application Cases

RX2000 series: 100+ systems shipped, 10+ years production-proven, serving 30+ customers

Silicon Photonics / VCSEL Die Sorting — Optical Communications Manufacturer

Application Cases

Optical Transceiver Dies

Silicon photonics, VCSEL/PD chips, and optical components sorting. Supports ultra-thin die pick-up, special structure avoidance, edge-grip for long chips, closed-loop force control and cleanroom configuration.

Optical Modules VCSEL Silicon Photonics COC Devices InP

Equipment Features

Multi-Stage Force Control · Closed-Loop Force · Cleanroom Config · AOI Inspection

Optical Communications

Power Semiconductor

Microwave RF

MEMS Sensors

Memory Chips

Integrated Circuits

Product Details

Precision is not a spec on a datasheet — it's the standard we maintain across every bond. RX2000SP3 Multi-Functional Die Sorter

Specialty Chip Sorting Experience

InP, GaAs, GaN, SiC high-value specialty chip sorting
Optimized processes for compound semiconductors and wide bandgap materials

Large/Thin Die Optimization

Optimized for large, thin, small and fragile dies
Custom nozzle tooling
Custom ejector pin solutions

Equipment Connectivity (SECS/GEM)

Custom network protocol
Barcode scanner & CCD recognition
1D/2D code recognition
Wafer mapping (TXT format)
Map read / parse / save

Precision Bond Force Control

Force range: 30–220g
Force accuracy: ±10g
Vacuum die detection

Flexible Material Handling

Max 8" wafer (ring / sub-ring options)
Waffle/Gel-pak: 2"×4 / 4"×2
Wafer de-static: ionizer

参数项	RX2000 SP3 Standard
XY Placement Accuracy	±38μm
Angular Accuracy	±3°
UPH	Max 4K Max 2K (AOI enabled)
Supported Die Size(Sample validation for out-of-range)	L×W: 0.25–7mmT: 100–500μm
Supported Wafer Size	Max 8" (Wafer frame/grip ring)
Supported Waffle/Gel-Pak Size	2"×4 / 4"×2 (optional)
Bond Force Range	30–220g
Bond Force Accuracy	±10g
Wafer De-Static	Ionizer
Ink Dot Detection	Supported
Pre-Bond Inspection	Supported
Wafer Map	Supported (TXT format, map read/parse/save)
Miss Die Detection	Vacuum detection
Weight	1,000 kg
Dimensions W×D×H	1,100×1,450×1,600 mm (excl. signal tower)

Film-to-Film Sorting

Transfer die from wafer film to wafer film(on wafer frame or wafer expander/grip ring)

Tray-to-Tray Sorting

Transfer die from chip box to chip box(waffle pack or gel-pak)

Film-to-Tray Sorting

Transfer die from wafer film to chip box

Tray-to-Film Sorting

Transfer die from chip box to wafer film

Multi-Project Wafer Sorting

Sort different projects and grades dies from a single wafer into different carriers based on wafer mapping

Multi-Bin Sorting

Sort different bin-grade dies from source film to new wafer film or waffle packs based on wafer map

Pattern Sorting

Custom position and pattern placement for non-standard process requirements

Application Scenarios

Application Scenarios & Process Guide

RX2000 covers IC, optical communications, power semiconductors, RF, and MEMS applications

Integrated Circuits

QFP / BGA / LGA / QFN traditional packages

QFP BGA LGA QFN

AI / HPC Chips

GPU / NPU / HBM high-performance computing

GPU NPU HBM

MEMS Sensors

IMU, pressure sensors, micromirrors, MEMS devices

IMU Pressure Micromirror

Microwave RF

MMIC / PA / LNA microwave RF devices

MMIC PA LNA

Photonics / Lasers

VCSEL / EML / silicon photonics high-precision sorting

VCSEL LiDAR Silicon Photonics

R&D & Low Volume

Flexible config from R&D to pilot to volume production

R&D Validation University Labs

Application Guidance

From Requirement to Deployment — Four-Step Process Engagement

ACCURACY provides full technical support from process evaluation through production, with modular configuration to meet diverse production needs.

Requirement Assessment

Submit die specs, carrier types, throughput targets. Our team delivers a feasibility report and recommended configuration (accuracy, force control, cleanroom level, handling).

Process Validation

Run your actual dies at our demo center. We provide complete sorting reports with process recommendations. Free sample trials available.

Equipment Delivery

Full system commissioning, on-site training. One operator can master the system. Standard delivery within 45 days.

Ongoing Support

8-hour response + 48-hour on-site in China. Continuous process optimization and fast spare parts supply.

RX2000SP3 8" Multi-Function Die Sorter

Application Cases

Optical Transceiver Dies

Precision is not a spec on a datasheet — it's the standard we maintain across every bond. RX2000SP3 Multi-Functional Die Sorter

Specialty Chip Sorting Experience

Large/Thin Die Optimization

Equipment Connectivity (SECS/GEM)

Precision Bond Force Control

Flexible Material Handling

Film-to-Film Sorting

Tray-to-Tray Sorting

Film-to-Tray Sorting

Tray-to-Film Sorting

Multi-Project Wafer Sorting

Multi-Bin Sorting

Pattern Sorting

Application Scenarios & Process Guide

Integrated Circuits

AI / HPC Chips

MEMS Sensors

Microwave RF

Photonics / Lasers

R&D & Low Volume

From Requirement to Deployment — Four-Step Process Engagement

Requirement Assessment

Process Validation

Equipment Delivery

Ongoing Support

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RX2000SP3
8" Multi-Function Die Sorter