IC package 8"/12" High-Speed IC Die Bonding

HX3600A
High-Speed IC Epoxy Die Bonder

HX3600A / HX1000 / HX2100 / HX2200

±25μm · Epoxy / DAF · 12" Wafer

±25μm

Placement Accuracy

14K

Output(UPH)

Max 12"

Wafer Size

The HX3600A is an ACCURACY epoxy die bonder. The HX Series High-Speed IC Epoxy Die Bonder delivers high-precision, high-efficiency automation for semiconductor packaging and testing.

The platform features a modular architecture supporting multiple feed formats and sorting modes for different production requirements.

HX Series High-Speed IC Epoxy Die Bonder Details

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Product Details

Precision is not a spec on a datasheet — it's the standard we maintain across every bond. HX Series High-Speed IC Epoxy Die Bonder

Auto Wafer Load/Unload (up to 12")

12" wafer auto load/unload
Compatible with wafer rings / sub-rings
Cassette and stack feed support
Quick product changeover

Reliable Bonding Performance

Excellent BLT and tilt consistency
Easy bond force adjustment
High reliability

Heated Bonding

Three-zone heating module
Independent temperature zones
DAF process support
Stacked die bonding

SECS/GEM Connectivity

SECS/GEM protocol support
Multi-equipment networking

参数项	HX1000	HX2100	HX2200	HX3600A
UPH (Up to)	13K	14K	13K	14K
Bonding Accuracy	±38μm	±38μm	±38μm	±25μm
Theta Accuracy	±3°	±3°	±3°	±2°
Cassette & Stack Feed	Both	Both	Both	Both
Wafer Size	Max 8"	Max 8"	Max 8"	Max 12"
DAF	-	-	Yes	Yes
Process Support	Epoxy	Epoxy	Epoxy/DAF	Epoxy/DAF

Epoxy Bonding

Compatible with QFP, BGA, LGA and other package types

DAF Process

Integrated heated substrate stage up to 200°C for DAF bonding applications

Stacked Die Bonding

Multi-layer stacked die bonding with superior BLT and tilt control

Application Scenarios

Application Scenarios & Process Guide

Application Guidance

From Requirement to Production — Four-Step Process Engagement

ACCURACY provides full technical support from process evaluation through production, ensuring rapid line integration.

Requirement Assessment

Submit die/substrate specs, throughput targets, and process requirements. Our team delivers a feasibility report and recommended configuration.

Process Validation

Run your actual dies and substrates at our demo center. We provide complete bonding accuracy reports and validation results.

Equipment Delivery

Full system commissioning, on-site process training. One operator can master the system. Supports pilot lot validation and production ramp.

Ongoing Support

8-hour remote response + 48-hour on-site support in mainland China. Continuous process optimization and fast spare parts supply.

HX3600A High-Speed IC Epoxy Die Bonder