Process Library

Conductive or non-conductive adhesive is precisely applied to substrate via dispenser, dipping/stamping, or jetting. Chips are picked and placed into adhesive by vacuum nozzle, then thermally cured to form stable interconnects. The most widely used die-attach process.

Utilizes eutectic alloys (AuSn, AuSi, etc.) as an intermediate layer to form a liquid phase above the eutectic temperature, achieving atomic-level diffusion bonding between chip and substrate for simultaneous electrical and mechanical interconnection.

A chip or dedicated stamping head is dipped into an adhesive pool to pick up a controlled amount, then transferred to the target position on the substrate. An efficient adhesive application method with highly uniform bondline thickness, especially suitable for multi-chip synchronous bonding, with precise control of adhesive coverage and fillet height. Key characteristic: area transfer, moderate adhesive volume, uniform coverage.

A precision pin array quantitatively picks up extremely small adhesive volumes from an adhesive pool, then precisely deposits them onto substrate target positions. A high-precision spot transfer process designed for ultra-small adhesive volume micro-assembly scenarios.

Chips are stacked layer by layer vertically with interlayer adhesive or bonding, maximizing area efficiency and minimizing signal path. A key technology for 3D / SiP packaging.

Flip chip bonding is a face-down, area-array interconnection technology where the chip's active surface is connected to substrate pads via bumps, achieving simultaneous electrical and mechanical interconnection. Compared to wire bonding's point-by-point connections, all interconnections are completed simultaneously with shorter signal paths and more compact packaging. Mainstream approaches include reflow, thermocompression bonding, and ultrasonic bonding.

Re-arranges chips from wafer or other carrier sources into waffle packs, gel packs, or wafer film for organized feeding to subsequent die bonding operations.

UV-curable adhesive cures within seconds upon ultraviolet irradiation. It remains liquid prior to UV exposure with unlimited pot life, allowing start/stop at any time with no material waste. Curing occurs at room temperature, with minimal thermal stress on substrates—suitable for inline production and temperature-sensitive devices. The adhesive locks components immediately after alignment, minimizing optical drift. Widely used in optical coupling alignment, lens bonding, and other precision assembly applications.

It uses ultrasonic vibration and pressure to friction‑bond the chip to the substrate at room temperature – no heat required. Perfect for delicate components that don’t like heat or are hard to warm up.