Typical Applications
Customer Cases
Diving deep into industry scenarios — each case embodies ACCURACY's precision technology and engineering expertise
Covering mainstream domains, empowering customer quality production
Customer Cases →Covering the full process chain from traditional to advanced packaging, delivering precise micro-assembly solutions across diverse industries
High-precision die bonding solutions for traditional packaging processes: QFP / BGA / LGA / QFN
Advanced packaging and precision die bonding for high-performance computing chips: GPU / NPU / HBM
Micro-assembly and hermetic packaging for MEMS devices: IMU, pressure sensors, micromirrors and more
AuSn eutectic bonding and high-reliability die attach for RF/microwave devices: MMIC / PA / LNA
High-precision alignment and micro-assembly for photonic devices: VCSEL / LiDAR / silicon photonics, meeting optical communication and sensing demands
Complete die bonding solutions for advanced packaging processes: Interposer / 3D Stacking / Fan-out
Diving deep into industry scenarios — each case embodies ACCURACY's precision technology and engineering expertise
