Customer Cases
Diving deep into industry scenarios — each case embodies ACCURACY's precision technology and engineering expertise
Indium Bump Interconnect Flip Chip Bonding
Indium interconnect bonding solutions for IR FPA, quantum computing, and Micro LED — ±0.5μm standard-die placement accuracy, 0.1 N ultra-low force, full temperature range
Brain-Computer Interface Sub-Micron Advanced Interconnect
How do you connect thousands of flexible electrodes — thinner than a human hair — precisely onto a fingernail-sized chip? This article deconstructs the three core engineering challenges from a micro-assembly perspective and demonstrates the process capability of the QX5000 in this domain.
High-Precision Laser Bar Eutectic Bonding
Addressing the three core challenges of laser bar packaging — thermal management, placement accuracy, and stress control — with a ±0.5μm eutectic die bonding solution
VCSEL Array Die Bonding
Precision dispensing and high-accuracy die bonding solution for VCSEL small chips, meeting the rigorous requirements of LiDAR modules for optical axis alignment and reliability
MicroLED Heterogeneous Bonding Solution — QX5000 Sub-Micron Bonding Validation Support
For MicroLED heterogeneous bonding process development scenarios, Accuracy's QX5000 delivers ±0.5μm standard-die placement accuracy, flip/back multi-process platform, and 0.1–30N full-range force control — supporting complete validation from process selection evaluation to small-batch trial production.
Panel-Level Packaging DAF Heated Bonding — ZX2200 Multi-Chip Bonding Case
As packaging carriers grow from wafers to large square panels, die bonding must resolve systematic engineering challenges—led by substrate warpage—alongside placement accuracy. ACCURACY works alongside customers through line upgrades.
Low-Temperature, Flux-Free VCSEL Flip-Chip: A Thermosonic Route Case
Thermosonic (ultrasonic) bonding completes Au stud bump interconnect for VCSEL and similar optoelectronic devices in a 120–200°C low-temperature window, flux-free and solid-state; Accuracy QX5000 offers a configurable ultrasonic module for low-temperature clean flip-chip R&D validation.
Indium Flip-Chip Bonding Interconnection — The Interconnection Evolution of Superconducting Quantum Chips from Planar to 3D
As superconducting quantum chips evolve from planar single-chip to Flip-chip and TSV 3D integration, how indium bump interconnection breaks through the I/O and packaging bottlenecks.