Sub-micron Sub-micron die bonding

Qixin QX5000
Multi-Function Sub-Micron Die Bonder

Name: QX5000 Multi-Function Sub-Micron Die Bonder
Brand: ACCURACY
SKU: qx5000
Availability: InStock
Rating: 4.8 (200 reviews)

QX5000

±0.5μm standard-die placement accuracy · Eutectic bonding · Multi-process module configuration

±0.5μm

Alignment accuracy

R&D grade

System positioning

450°C

Heating temperature

QX5000 is a multi-function sub-micron die bonder designed for frontier product R&D and process validation, addressing emerging fields such as silicon photonics integration, photonic packaging, high-power lasers and CPO. The system supports eutectic bonding, flip-chip/face-up placement, thermocompression ultrasonic bonding and other processes, with optional modules to match customer needs.

QX5000 adopts an ultra-precision air-bearing motion platform and dual-camera high-resolution vision system, combined with a self-developed full closed-loop real-time compensation algorithm, enabling ±0.5μm alignment accuracy.

QX5000 Multi-Function Sub-Micron Die Bonder Details

Front

Application Cases

For high-power lasers, laser arrays, lens arrays and precision MEMS placement applications

Application Cases

Silicon photonics transceiver

Silicon photonics transceivers integrate LD, modulator, waveguide and PD on a silicon photonics chip. Optical coupling alignment error must be within 2 μm and angular error ≤ 0.1°, otherwise optical loss rises sharply. CTE mismatch between laser and silicon waveguide requires low-stress placement.

Silicon photonics 800G/1.6T Optical communications CPO Data center

Equipment Features

±0.5μm alignment accuracy · temperature-force integration · modular upgrade path

Silicon photonics transceiver

VCSEL / photodiode array

High-power laser

Advanced packaging

Product Details

Precision is not a spec on a datasheet — it's the standard we maintain across every bond. QX5000 Multi-Function Sub-Micron Die Bonder

±0.5μm alignment accuracy

Dual-camera vision system (alignment / side-view)
Air-bearing motion platform
Full closed-loop compensation algorithm
Laser-assisted positioning

Loading & tooling

Manual loading/unloading
Customized collets
Custom fixtures and pads

Inert atmosphere module

Nitrogen-protected chamber
Optional formic acid generator

Precise temperature control

Heated workstage
450°C ± 1°C heating zone
Accurate eutectic-point triggering, no over- or under-bonding

Precise force control

Force range 0.1–30 N ± 0.01 N
High-force option available

Full-parameter data logging

Per-die process data recording
HD process observation and recording
Operation log
Recipe import/export across same-model systems
Network connectivity

Parameter	QX5000
Placement accuracy	±0.5μm (standard die)
FOV	0.5×0.6 mm – 6×7.2 mm
Supported die size	0.15 mm × 15 mm T: 0.1–10 mm
Heating temperature	450°C ± 1°C
Heating rate	20°C/s
Cooling rate	5°C/s
θ-axis fine travel	± 5°
Workstage size	50 mm × 50 mm (customizable)
Bonding force range	0.1 N – 30 N
Environmental requirements	Temperature 22±4°C; humidity 50±15%
Air supply	Pressure: 0.5–0.7 MPa; quality: ISO 8573-1 class 4; flow: 50–300 L/min (all modules)
Dimensions	800 × 500 × 700 mm
Weight	200 kg

Eutectic bonding

Uses AuSn, AuSi and other eutectic alloys as intermediate layers to form a liquid phase above the eutectic temperature, enabling atomic-level diffusion bonding

Flip-chip (face-down)

Die placed face-down

Face-up placement

Die placed face-up

UV curing (optional)

Uses UV light to trigger rapid adhesive curing within seconds, suitable for temperature-sensitive devices and inline production

Thermocompression bonding

Applies pressure and heat simultaneously to form solid-state diffusion bonding between die bumps and substrate pads

Dispensing / dipping (optional)

Adhesive bonding process module configuration

Application Scenarios

Application Scenarios & Process Guide

QX5000 covers silicon photonics integration, high-power lasers, advanced packaging, quantum computing, precision MEMS/MOEMS, μLED and other frontier applications

Silicon photonics & photonic integration

Optical transceivers, optical engines, optical interconnects

Silicon photonics Optical engines Optical interconnects

High-power lasers

Laser diode arrays, pump sources, laser bars, thermal management

Laser diode arrays Pump sources Laser bars Thermal management

Advanced packaging

Heterogeneous integration, flip-chip, 2.5D, 3D, CoG

Heterogeneous integration Flip-chip 2.5D 3D CoG

Quantum computing

Quantum chips, cryogenic devices, superconducting quantum, precision interconnects

Quantum chips Cryogenic devices Superconducting quantum Precision interconnects

Precision MEMS/MOEMS

MEMS sensors, micro-mirrors

MEMS sensors Micro-mirrors

μLED / Micro LED

Micro LED, micro-displays

Micro LED Micro-display

Application Guidance

From requirement to deployment — four-step process engagement

iCortex provides full technical support from process evaluation to R&D validation, with flexible modular configuration to match customer innovation needs

Requirement evaluation

Provide product specifications, process requirements and R&D goals; the technical team delivers a feasibility report and recommended configuration

Process validation

Sample validation tests are run in the packaging lab using your actual die and substrate to ensure process requirements are met

System delivery

System commissioning, on-site process tuning and operator training

Ongoing support

Domestic 8-hour response + 48-hour on-site arrival, with continuous process optimization support

Qixin QX5000 Multi-Function Sub-Micron Die Bonder

Application Cases

Silicon photonics transceiver

Precision is not a spec on a datasheet — it's the standard we maintain across every bond. QX5000 Multi-Function Sub-Micron Die Bonder

±0.5μm alignment accuracy

Loading & tooling

Inert atmosphere module

Precise temperature control

Precise force control

Full-parameter data logging

Eutectic bonding

Flip-chip (face-down)

Face-up placement

UV curing (optional)

Thermocompression bonding

Dispensing / dipping (optional)

Application Scenarios & Process Guide

Silicon photonics & photonic integration

High-power lasers

Advanced packaging

Quantum computing

Precision MEMS/MOEMS

μLED / Micro LED

From requirement to deployment — four-step process engagement

Requirement evaluation

Process validation

System delivery

Ongoing support

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ZX2200 SiP Multi-Chip High-Precision Die Bonder

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Qixin QX5000
Multi-Function Sub-Micron Die Bonder