Sub-Micron Sub-Micron Die Bonding

QX5000
Multi-Purpose Sub-Micron Die Bonder

Name: QX5000 Multi-Purpose Sub-Micron Die Bonder
Brand: 艾科瑞思

QX5000

±0.5μm · Multi-Process Modules

±0.5μm

Placement Accuracy

Waffle packs

Input/output

450°C

Heating Temperature

The QX5000 is an ACCURACY multi-purpose sub-micron die bonder purpose-built for advanced R&D and process validation, supporting silicon photonics, photonic packaging, high-power lasers, and CPO applications. The system supports eutectic bonding, flip-chip / face-up bonding, thermosonic bonding and more, with modular add-ons available. Featuring an ultra-precision air-bearing motion platform with dual-camera high-resolution vision and proprietary closed-loop real-time compensation, the QX5000 delivers ±0.5μm sub-micron alignment accuracy.

QX5000 Multi-Purpose Sub-Micron Die Bonder 细节图

Front

应用产品

应用案例

For high-power lasers, laser arrays, lens arrays, precision MEMS assembly

800G/1.6T Silicon Photonic Transceiver R&D

应用案例

Silicon Photonics

Silicon Photonics Modules

Silicon photonic transceiver module integrating laser (LD), modulator, waveguide and photodetector (PD) on a silicon photonics chip. Optical coupling alignment error must be under 2μm with angular error ≤0.1°, or optical loss rises sharply. CTE mismatch between laser and silicon waveguide requires low-stress bonding.

Silicon Photonics 800G/1.6T Optical Comm CPO Data Center

设备特性

±0.5μm Alignment · Temp-Force-Position Control · Modular Upgrade Path

Silicon Photonics

VCSEL / PD Arrays

High-Power Lasers

Advanced Packaging

产品详情

深度了解 QX5000 Multi-Purpose Sub-Micron Die Bonder

±0.5μm Sub-Micron Alignment

Dual-camera vision system (alignment/side view)
Air-bearing motion platform
Closed-loop compensation algorithm
Laser-assisted positioning

Pick Up Tools

Manual load/unload
Custom nozzles
Custom carriers & spacers

Gas Protection Module

N₂ protection chamber
Formic acid module (optional)

Precision Temperature Control

Heated stage
Stage zone at 450°C±1°C
Accurate eutectic triggering, no over/under soldering

Precision Force Control

Force range: 0.1–30N ±0.01N
High force optional

Full Parameter Logging

Per-die process data recording
HD process observation & recording
Operation log
Recipe import/export across machines
Network connectivity

参数项	QX5000
Placement Accuracy	±0.5μm
FOV	0.5×0.6mm – 6×7.2mm
Supported Component Size	0.15mm×15mm, T: 0.1–10mm
Heating Temperature	450°C±1°C
Heating Rate	20°C/s
Cooling Rate	5°C/s
θ Axis Fine Adjustment	±5°
Workbench Size	50mm×50mm (customizable)
Bond Force Range	0.1N – 30N
Environment	Temp 22±4°C; Humidity 50±15%
Air Supply	Pressure: 0.5–0.7MPa, Quality: ISO8573-1 Class 4, Flow: 50–300L/min (all modules)
Dimensions	800×500×700mm
Weight	200kg

Eutectic Bonding

AuSn, AuSi eutectic alloy interlayer for atomic-level diffusion bonding above eutectic temperature

Flip-Chip Bonding

Face-down die attach

Face-Up Bonding

Face-up die attach

UV Curing (Optional)

Rapid UV-initiated adhesive curing within seconds, ideal for temperature-sensitive devices and inline production

Thermo-Compression Bonding

Simultaneous heat and pressure bonding for direct solid-state diffusion between die bumps and substrate pads

Dispensing / Stamping (Optional)

Adhesive dispensing and stamping module configuration

应用场景

适用领域与工艺指引

QX5000 covers silicon photonics, high-power lasers, advanced packaging, quantum computing, MEMS/MOEMS, and μLED applications

Silicon Photonics

Optical transceivers, optical engines, optical interconnects

Silicon Photonics Optical Engine Interconnect

High-Power Lasers

Laser arrays, pump sources, laser bars, thermal management

Laser Arrays Pump Source Laser Bars Thermal

Advanced Packaging

Heterogeneous integration, flip-chip, 2.5D, 3D, COG

Heterogeneous Flip-Chip 2.5D 3D COG

Quantum Computing

Quantum chips, cryogenic devices, superconducting, precision interconnects

Quantum Chips Cryogenic Superconducting Interconnects

Precision MEMS/MOEMS

MEMS sensors, micromirrors

MEMS Sensors Micromirrors

μLED / Micro LED

Micro LED, micro displays

Micro LED Micro Display

应用指引

From Requirement to Deployment — Four-Step Process Engagement

ACCURACY provides full technical support from process evaluation through R&D verification, with modular configuration to flexibly meet your innovation needs.

Requirement Assessment

Submit product specs, process requirements and R&D targets. Our team delivers a feasibility report and recommended configuration.

Process Validation

Run your actual dies and substrates at our demo center for validation, ensuring all process requirements are met.

Equipment Delivery

Full system commissioning, on-site process training.

Ongoing Support

Remote support within 8 hours; on-site within 48 hours in mainland China. Continuous process optimization support.

QX5000 Multi-Purpose Sub-Micron Die Bonder

应用案例

Silicon Photonics Modules

深度了解 QX5000 Multi-Purpose Sub-Micron Die Bonder

±0.5μm Sub-Micron Alignment

Pick Up Tools

Gas Protection Module

Precision Temperature Control

Precision Force Control

Full Parameter Logging

Eutectic Bonding

Flip-Chip Bonding

Face-Up Bonding

UV Curing (Optional)

Thermo-Compression Bonding

Dispensing / Stamping (Optional)

适用领域与工艺指引

Silicon Photonics

High-Power Lasers

Advanced Packaging

Quantum Computing

Precision MEMS/MOEMS

μLED / Micro LED

From Requirement to Deployment — Four-Step Process Engagement

Requirement Assessment

Process Validation

Equipment Delivery

Ongoing Support

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QX5000
Multi-Purpose Sub-Micron Die Bonder