Die Sorting Intelligent Sorting Expert

RX3000
12-inch Multi-functional Die Sorter

RX3000 / RX3000 adv

±10μm · Film/Tray-to-Tray/Film · 12" Wafer

±10/25μm

Placement Accuracy

≥2,000

Throughput (UPH)

Max 12"

Wafer Size

RX3000 is a turnkey sorting platform for high-value chips, supporting laser diodes, special-structure devices, and more. It offers four sorting modes: film-to-film, film-to-waffle pack, waffle pack-to-film, and waffle pack-to-waffle pack, and handles 6/8/12-inch wafers, waffle packs, and gel packs.

With closed-loop force control, Class 100 clean environment, and intelligent software, it enables damage-free sorting of ultra-thin, irregular, and fragile chips, plus wafer map binning.

RX3000 12" Multi-Functional Die Sorter 细节图

Front

Top

Wafer Stage

Tool Changer

Pick-Up

Wafer Change

应用产品

应用案例

RX3000 series: 100+ systems shipped, 10+ years production-proven, serving 30+ customers

Silicon Photonics / VCSEL Die Sorting — Optical Communications Manufacturer

应用案例

Optical Transceiver Dies

Silicon photonics, VCSEL/PD chips, and optical components sorting. Supports ultra-thin die pick-up, special structure avoidance, edge-grip for long chips, closed-loop force control and cleanroom configuration.

Optical Modules VCSEL Silicon Photonics COC Devices InP

设备特性

Multi-Stage Force Control · Closed-Loop Force · Cleanroom Config · AOI Inspection

Optical Communications

Power Semiconductor

Microwave RF

MEMS Sensors

AI Chips

Integrated Circuits

产品详情

深度了解 RX3000 12" Multi-Functional Die Sorter

Closed-Loop Force Control

Real-time force curve display and recording
Standard force: 50~150g
Optional 10g low-force control
Rotary wafer stage 180° / 90° flip sorting

Material Handling

6/8/12" wafer compatible
Wafer ring / sub-ring
Auto wafer load/unload
Waffle pack / gel-pak

Smart Calibration, Fast Changeover

1,000+ recipes
Auto calibration system
7 nozzle tools
5 ejector pin options

Cleanroom & ESD Configuration

Class 10K/1K/100 cleanroom options
Wafer de-static module

3,000+ Pick-and-Place Solutions

Custom nozzle tooling
Multi-segment / sync ejector options
Multi-stage force control customization

Full-Process Traceability

Wafer mapping read & generate
Barcode / 2D code recognition
Assisted OCR
Assisted AOI
Custom network & MES integration

参数项	RX3000 Standard	RX3000 Upgrade	RX3000 ADV
Placement Accuracy	±38μm θ:±3°	±25μm θ:±1°	±10μm θ:±0.5°
UPH	2000	1500	1200
Bond Force Range	Standard 50~100g±5g, 100~150g±10% Custom: 10~30g±3g, 30~150g±5g, 150~300g±10%	Standard 50~100g±5g, 100~150g±10% Custom: 10~30g±3g, 30~150g±5g, 150~300g±10%	Standard 50~100g±5g, 100~150g±10% Custom: 10~30g±3g, 30~150g±5g, 150~300g±10%
Standard Condition	Die: 2×2×0.1mm, no look-up, no aux functions, die accuracy ±2μm, 8" wafer to wafer	Die: 2×2×0.1mm, no look-up, no aux functions, die accuracy ±2μm, 8" wafer to wafer	Die: 2×2×0.1mm, no look-up, no aux functions, die accuracy ±2μm, 8" wafer to wafer
Supported Die Size	Die: 0.3–10mm Thickness: 100μm<T<350μm (Out-of-range: sample validation available)	Die: 0.3–10mm Thickness: 100μm<T<350μm (Out-of-range: sample validation available)	Die: 0.3–10mm Thickness: 100μm<T<350μm (Out-of-range: sample validation available)
AOI Function	Physical defect detection: chipping, cracks, scratches, contamination Die 0.3–5mm, detection ≥25μm; brightness ratio > 25%	Physical defect detection: chipping, cracks, scratches, contamination Die 0.3–5mm, detection ≥25μm; brightness ratio > 25%	Physical defect detection: chipping, cracks, scratches, contamination Die 0.3–5mm, detection ≥25μm; brightness ratio > 25%
Up-look Inspection	Die alignment & ejector mark inspection	Die alignment & ejector mark inspection	Die alignment & ejector mark inspection
Auto Load/Unload	Auto wafer ring load/unload	Auto wafer ring load/unload	Auto wafer ring load/unload
Input method	Wafer frame(iron ring): 12" ,8",6" Grip ring(expander ring) ring 6",8" Gel-pak/waffle pack: 2", 4" optional	Wafer frame(iron ring): 12" ,8",6" Grip ring(expander ring) ring 6",8" Gel-pak/waffle pack: 2", 4" optional	Wafer frame(iron ring): 12" ,8",6" Grip ring(expander ring) ring 6",8" Gel-pak/waffle pack: 2", 4" optional
Output method	Wafer frame(iron ring): 12" ,8",6" Grip ring(expander ring) ring 6",8" Gel-pak/waffle pack: 2", 4" optional	Wafer frame(iron ring): 12" ,8",6" Grip ring(expander ring) ring 6",8" Gel-pak/waffle pack: 2", 4" optional	Wafer frame(iron ring): 12" ,8",6" Grip ring(expander ring) ring 6",8" Gel-pak/waffle pack: 2", 4" optional
Wafer Rotation	Upgradeable to ±180°	Upgradeable to ±180°	Upgradeable to ±180°
Miss Die Detection	Vacuum detection	Vacuum detection	Vacuum detection
Wafer De-Static	Ionizer	Ionizer	Ionizer
Ink Dot Inspection	Supported	Supported	Supported
Wafer Map	Supported	Supported	Supported
Software	RX3000 CN/EN version	RX3000 CN/EN version	RX3000 CN/EN version

Film-to-Film Sorting

Die transfer between wafer films

Tray-to-Tray Sorting

Die transfer between trays

Film-to-Tray Sorting

Sort dies from wafer film into trays

Tray-to-Film Sorting

Rearrange trayed dies onto wafer film

Multi-Project / Panel Wafer Sorting

Sort different projects and grades from a single wafer into different carriers per wafer map

Multi-Bin Sorting

Sort different bin-grade dies from source film to new film or waffle packs per wafer map

Pattern Sorting

Custom position and pattern array placement for non-standard process requirements

应用场景

适用领域与工艺指引

RX3000 covers IC, optical communications, power semiconductors, RF, and MEMS applications

Integrated Circuits

QFP / BGA / LGA / QFN traditional packages

QFP BGA LGA QFN

AI / HPC Chips

GPU / NPU / HBM high-performance computing

GPU NPU HBM

MEMS Sensors

IMU, pressure sensors, micromirrors, MEMS devices

IMU Pressure Micromirror

Microwave RF

MMIC / PA / LNA microwave RF devices

MMIC PA LNA

Photonics / Lasers

VCSEL / EML / silicon photonics high-precision sorting

VCSEL LiDAR Silicon Photonics

R&D & Low Volume

Flexible config from R&D to pilot to volume production

R&D Validation Low Volume University Labs Fast Iteration

应用指引

From Process Evaluation to Volume Production

ACCURACY provides full technical support from process evaluation through production, with modular configuration to meet diverse production needs.

Requirement Assessment

Submit die specs, carrier types, throughput targets. Our team delivers a feasibility report and recommended configuration (accuracy, force control, cleanroom level, handling).

Process Validation

Run your actual dies at our demo center. We provide complete sorting reports with process recommendations. Free sample trials available.

Equipment Delivery

Full system commissioning, on-site training. One operator can master the system. Standard delivery within 45 days.

Ongoing Support

8-hour response + 48-hour on-site in China. Continuous process optimization and fast spare parts supply.

RX3000 12-inch Multi-functional Die Sorter

应用案例

Optical Transceiver Dies

深度了解 RX3000 12" Multi-Functional Die Sorter

Closed-Loop Force Control

Material Handling

Smart Calibration, Fast Changeover

Cleanroom & ESD Configuration

3,000+ Pick-and-Place Solutions

Full-Process Traceability

Film-to-Film Sorting

Tray-to-Tray Sorting

Film-to-Tray Sorting

Tray-to-Film Sorting

Multi-Project / Panel Wafer Sorting

Multi-Bin Sorting

Pattern Sorting

适用领域与工艺指引

Integrated Circuits

AI / HPC Chips

MEMS Sensors

Microwave RF

Photonics / Lasers

R&D & Low Volume

From Process Evaluation to Volume Production

Requirement Assessment

Process Validation

Equipment Delivery

Ongoing Support

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RX3000
12-inch Multi-functional Die Sorter