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SiP Packaging SiP Multi-Chip Die Bonder Expert

ZX2200
SiP Multi-Chip High-Precision Die Bonder

ZX2200 / ZX2200 plus / ZX2200 evo adv

±3μm Accuracy · Multi-Process Platform · Purpose-Built for SiP Multi-Chip Bonding

±3/7/10μm
Placement Accuracy
≥1,200
Throughput (UPH)
Max 12"
Wafer Size

ZX2200 evo adv — ACCURACY's latest SiP multi-chip high-precision die bonder with ±3μm accuracy. Designed for optical, microwave/RF, LiDAR, and MEMS packaging.

Modular architecture supports wafer, waffle, and gel pack feeds, and processes dispensing, stamping, and flip-chip bonding — enabling multi-process flexibility and fast changeover in one machine.

应用产品

应用案例

ZX2200 is in stable production at leading manufacturers in optical communications, RF, LiDAR, and MEMS sectors

TO/BOX Packaging Line — Optical Communications Manufacturer
应用案例
Optical Transceiver Modules

Optical Transceiver Modules

A data-center optical module manufacturer required multi-format packaging across TO/BOX/COB/COC configurations. Key challenges included handling thin, fragile dies with stringent requirements on placement accuracy, epoxy coverage, and fillet height control.
TO Package BOX Package COB/COC Optical Transceiver
设备特性
Epoxy Volume Inspection · BLT Algorithm Optimization · 12-Tool Auto Changeover · Up to ±3μm Placement Accuracy
TO/BOX Packaging Line — Optical Communications Manufacturer
Optical Communications
Optical Communications
RF Kovar Package Assembly Line — Defense Electronics Manufacturer
Microwave / RF
Microwave / RF
VCSEL Assembly Line — Automotive LiDAR Manufacturer
LiDAR
LiDAR
High-Mix Production Line — MEMS Sensor Manufacturer
MEMS Sensors
MEMS Sensors
Consumer SiP Multi-Chip Die Bonding
Consumer Electronics
Consumer Electronics
Memory Die Stack Bonding
Memory
Memory
产品详情

深度了解 ZX2200 SiP Module Multi-Chip High-Precision Die Bonder

±3μm Placement Accuracy

High-precision positioning algorithm with intelligent thermal drift compensation
±3μm repeatable placement accuracy
CPK ≥ 1.33 with look-up correction
Production-ready for demanding SiP applications

Multi-Process Flexibility on One Platform

Independent dispenser / bond-head integrated dispenser
Independent stamping / bond-head integrated stamping
Contact / laser height measurement
Flip chip / flux / pneumatic dispensing / auger valve
Pin transfer
Modular design for rapid process expansion

Ultra-Fast Changeover

12-nozzle auto tool change
Stamping tool changeover
5-pin auto ejector switch
One-click changeover for 1,000+ recipes

3,000+ Die Pick-and-Place Solutions

Custom nozzle tooling for non-standard die shapes
Multi-segment ejector pin / force-optimized profiles
Extra-long and ultra-thin die handling
Deep-cavity pick with clearance control

Full-Process Traceability

Per-die traceability management
Wafer MAP and substrate MAP support
Barcode / 2D code recognition
Customizable network protocol · MES integration ready

Multiple Feed Formats

Automatic load / unload cycling
8" – 12" wafer cassette auto-loader
Inline track interface
Static waffle pack / gel-pak feed

参数项 ZX2200 ZX2200 plus ZX2200 evo adv
XY Placement Accuracy ±10μm ±7μm ±3μm
UPH ≥ 1200 ≥750 ≥500
Angular Placement Accuracy ±0.25° ±0.15° ±0.15°
Standard Condition Look-up single-pass (no transfer), post-bond inspection(Std: 2×2×0.2mm die, single die surface mount, 432 pads, look-up/look-down center offset < ±2μm) Transfer station, post-bond inspection(Std: 2×2×0.2mm die, single die surface mount, 432 pads, look-up/look-down center offset < ±2μm) Transfer station, post-bond inspection(Std: 2×2×0.2mm die, single die surface mount, 432 pads, look-up/look-down center offset < ±2μm)
Bond Force 50g – 400g (50–100g: ±5g; 101–400g: ±5%)Custom option: 10–150g ±3g 50g – 400g (50–100g: ±5g; 101–400g: ±5%)Custom option: 10–150g ±3g 50g – 400g (50–100g: ±5g; 101–400g: ±5%)Custom option: 10–150g ±3g
Supported Die Size L×W: 0.15–35mm, T: 0.2–2.5mm(L or W < 0.5mm or > 10mm, T < 0.2mm: custom validation required) L×W: 0.15–35mm, T: 0.2–2.5mm(L or W < 0.5mm or > 10mm, T < 0.2mm: custom validation required) L×W: 0.15–35mm, T: 0.2–2.5mm(L or W < 0.5mm or > 10mm, T < 0.2mm: custom validation required)
Supported Substrate Size L: 300mm, W: 55–200mm, T: < 12mmCavity depth: 8mm (> 8mm: custom validation) L: 300mm, W: 55–200mm, T: < 12mmCavity depth: 8mm (> 8mm: custom validation) L: 300mm, W: 55–200mm, T: < 12mmCavity depth: 8mm (> 8mm: custom validation)
Supported Wafer Size 8" – 12" 8" – 12" 8" – 12"
Waffle Pack / Gel-Pak Size 2" and 4" 2" and 4" 2" and 4"
Machine Dimensions W×D×H (mm) 2200×1700×1800 (excl. signal tower) 2200×1700×1800 (excl. signal tower) 2200×1700×1800 (excl. signal tower)
Machine Weight 1500 kg 1500 kg 1500 kg
1

Epoxy Bonding

Compatible with QFP/BGA/LGA and other package types. Supports both dispensing and stamping adhesive application methods.

2

Flip Chip Bonding

Supports C4 bump and Cu Pillar flip-chip interconnect for FC-BGA/FC-CSP advanced packaging. Available with flux or standalone flip placement.

3

Stamping / Pin Transfer

High-precision adhesive transfer for miniaturized die including GaAs and other compound semiconductors. Precise epoxy volume control for small-geometry applications.

4

UV Curing

Optional integrated UV curing module for in-situ curing immediately after dispensing.

5

DAF (Die Attach Film)

Integrated heated substrate stage supporting up to 200°C. Suitable for heated bonding processes requiring DAF adhesive.

应用场景

适用领域与工艺指引

ZX2200 serves six key application segments: optical communications, RF, LiDAR, MEMS, consumer electronics, and memory

Optical Transceiver Modules

Multi-format TO/BOX/COB/COC packages. Laser diode, detector & passive component placement with epoxy dispensing & stamping.

TO/BOX Optical Module VCSEL Laser Die Optical Filter COB/COC TIA PD

Microwave / RF Modules

High-density multi-chip placement for military & commercial RF kovar packages. Deep-cavity pick & 45° tilt bonding.

RF Front-End Phased Array T/R RF SoC Power Amp Module Switch/Filter Military Package PA LNA GaN

LiDAR Modules

VCSEL & photodetector assembly. 99.8% yield for 100μm thin die with programmable soft-landing force control.

LiDAR VCSEL Automotive LiDAR FMCW

MEMS Sensors

Pressure, capacitive & medical MEMS sensor module bonding. Soft-landing pick for fragile die, 10KK+ throughput.

Accelerometer Gyroscope Pressure Sensor Magnetic Sensor MEMS Mic Medical IMU Capacitive

Consumer ICs

Flexible packaging line: 1,000+ recipes, 10-min changeover, high-mix low-volume capability.

Fingerprint Sensor Bluetooth SoC Power Management Wearables Filter TWS Earbuds

Memory

Flexible process & feed options. Scalable design supporting smooth ramp from R&D to pilot to volume production.

Memory Stack Power IC Memory Module Array Placement Memory Controller
应用指引

From Requirement to Production — Four-Step Process Engagement

ACCURACY provides full technical support from process evaluation through volume production, ensuring rapid line integration.

1

Requirement Assessment

Submit die/substrate specs, throughput targets, and process requirements. Our engineering team delivers a feasibility report and recommended configuration.

2

Process Validation

Run your actual dies and substrates at our demo center. We provide a complete placement accuracy report and validation results against your process requirements.

3

Equipment Delivery

Full system commissioning, on-site process training, and operator qualification. One operator can master the system; supports pilot lot validation and production ramp.

4

Ongoing Support

8-hour remote response + 48-hour on-site support within mainland China. Continuous process optimization recommendations and fast spare parts supply.

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