Panel-Level Packaging DAF Heated Bonding — ZX2200 Multi-Chip Bonding Case

Three Core Bonding Challenges on Large Panels

The customer is a panel-level packaging and test manufacturer running System-in-Package (SiP) multi-chip bonding. Substrate size is 330×330 mm with significant incoming warpage. The product line covers three adhesive routes—epoxy dispensing, DAF (Die Attach Film), and sintered silver—and all DAF-type products require bonding under a heated substrate condition.

Panel-level packaging replaces the round wafer carrier with a square panel: higher area utilization and lower per-die cost—but the engineering challenges of a large substrate go far beyond "a bigger board." The following are the application challenges of large-substrate / panel-level DAF heated bonding.

Table: Challenges in panel-level / large-substrate multi-chip DAF heated bonding

These three pain points are interconnected—thermal warpage affects chuck holding and alignment reference, the multi-process window determines changeover efficiency and uptime, and panel-wide consistency is the acceptance gate where accuracy and throughput must hold simultaneously. Improving a single dimension is not enough; intervention is needed simultaneously across four dimensions: thermal field, chuck holding & leveling, process platform, and accuracy closed-loop.

ZX2200 Solution: Addressing the Three Challenges One by One

Built on the ZX2200 multi-chip bonding platform, ACCURACY delivers a systematic solution to the three core challenges of large-substrate heated bonding across three dimensions—thermal field & chuck holding, process platform, and accuracy closed-loop:

Overcoming thermal warpage instability — controlled temperature + flat chuck holding + accurate alignment + complete compensation

• · Temperature base: The bonding stage integrates a heating module up to 200°C with ±5°C uniformity and automatic over-temperature alarm—providing the controlled thermal field for DAF bonding.
• · Vacuum chuck holding & leveling: A custom large-format work stage with switchable vacuum area + multi-point support; after installation, panel flatness is reliable, able to directly chuck and level large warped substrates.
• · Alignment reference: Substrate alignment marks assist loading and anti-reverse recognition; PR (Pattern Recognition) image recognition locates the first-point template without alignment holes, with reliable substrate recognition.
• · Full-area Z-height compensation: Laser height measurement combined with stage-side full-area height compensation eliminates residual height differences after chucking and heating; the bond head adapts Z-height per force-control needs.

Overcoming multi-process integration — one platform runs three processes, changeover ≤30 minutes

• · Modular processes: Supports dispensing, stamping, sintered silver bonding, and flip chip—a modular architecture enables customers to complete process development, validation, and volume ramp on a single platform.
• · Multi-variety configuration: Multi-station feeders supply material, compatible with Wafer and Waffle Pack; supports resin, steel, copper, and other substrate materials and different substrate sizes.
• · Rapid changeover: Multiple tools auto-switch with one-click recipe library calls; when switching products, nozzle, ejector pin, and other tool changes and calibration can be shortened to 30min.

Overcoming accuracy consistency and throughput — XY closed-loop correction + dual bond heads for volume production

• · Inline XY closed-loop: Post-bond accuracy is displayed and statistically monitored in real time; actual-vs-target deviations are automatically identified, corrected, and compensated; per-die position and angle compensation reduces accumulated error.
• · Dual bond heads in parallel: The dual bond-head structure simultaneously meets both panel-wide consistency requirements and production takt, suitable for high-precision, high-mix, and DAF volume scenarios.